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 PJD06N03
25V N-Channel Enhancement Mode MOSFET
TO-252
FEATURES
* RDS(ON), VGS@10V,IDS@30A=6m * RDS(ON), VGS@4.5V,IDS@30A=9m * Advanced trench process technology * High Density Cell Design For Uitra Low On-Resistance * Specially Designed for DC/DC Converters and Motor Drivers * Fully Characterized Avalanche Voltage and Current * Pb free product : 99% Sn above can meet RoHS environment substance directive request
MECHANICALDATA
* Case: TO-252 Molded Plastic * Terminals : Solderable per MIL-STD-750,Method 2026 * Marking : 06N03
Drain
Gate
Source
Maximum RATINGS and Thermal Characteristics (TA=25OC unless otherwise noted )
PA RA M E TE R D r a i n- S o ur c e Vo l t a g e G a t e - S o ur c e Vo l t a g e C o nt i nuo us D r a i n C ur r e nt P ul s e d D r a i n C ur r e nt
1)
S ym b o l VD S VGS ID ID M TA = 2 5 O C TA = 7 5 O C PD TJ , TS T G EAS RJ C RJ A
Li mi t 25 +20 60 280 6 2 .5 3 7 .5 -5 5 to + 1 5 0 180 2 .0 50
U ni t s V V A A W
O
M a xi m um P o w e r D i s s i p a t i o n O p e r a t i n g J u n c t i o n a n d S t o r a g e Te m p e r a t u r e R a n g e Avalanche Energy with Single Pulse ID=27A, VDD=25V, L=0.5mH Junction-to-Case Thermal Resistance Junction-to Ambient Thermal Resistance(PCB mounted)2
C
mJ
O
C /W C /W
O
Note: 1. Maximum DC current limited by the package 2. Surface mounted on FR4 board, t < 10 sec PAN JIT RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,FUNCTIONS AND RELIABILITY WITHOUT NOTICE
STAD-JUL.19.2006
PAGE . 1
PJD06N03
ELECTRICALCHARACTERISTICS
P a ra me te r S ta ti c D r a i n- S o ur c e B r e a k d o w n Vo l t a g e G a t e Thr e s ho l d Vo l t a g e D r a i n- S o ur c e O n- S t a t e R e s i s t a nc e D r a i n- S o ur c e O n- S t a t e R e s i s t a nc e Ze r o G a t e Vo l t a g e D r a i n C ur r e nt Gate Body Leakage Forward Transconductance Dynamic V D S = 1 5 V , ID = 1 5 A , V G S = 5 V To t a l G a t e C h a r g e Qg G a t e - S o ur c e C ha r g e G a t e - D r a i n C ha r g e Tu r n - O n D e l a y Ti m e Tu r n - O n R i s e Ti m e Tu r n - O f f D e l a y Ti m e Tu r n - O f f F a l l Ti m e In p u t C a p a c i t a n c e O ut p ut C a p a c i t a nc e R e v e r s e Tr a n s f e r C a p a c i t a n c e S o ur c e - D r a i n D i o d e M a x. D i o d e F o r w a r d C ur r e nt D i o d e F o rwa rd Vo lta g e Is VSD IS = 3 0 A , V G S = 0 V 0 .9 60 1 .2 A V Qg s Qg d Td ( o n ) trr td (o ff) tf Ciss Coss C rs s V D S =1 5 V, V G S =0 V f=1 .0 MHZ VD D =15V , RL =15 ID =1A , VG E N =10V RG =3.6 V D S = 1 5 V , ID = 1 5 A V G S =10V 3 8 .2 4 .8 9 .5 11.5 11.0 43 1 7 .5 1750 480 310 nC 16 18 ns 60 25 pF 2 1 .8 BVD SS V G S (th) RD S (o n) RD S (o n) ID S S IG S S g fS V G S = 0 V , ID = 2 5 0 u A V D S = V G S , ID = 2 5 0 u A VG S =4.5V, ID =30A VG S =10V, ID =30A VD S =25V, VG S =0V V G S =+2 0 V, V D S =0 V V D S = 1 0 V , ID = 1 5 A 25 1 30 7 .5 5.0 3 9 .0 m 6.0 1 +100 uA nA S V V S ym b o l Te s t C o n d i t i o n M i n. Ty p . M a x. U ni t s
Switching Test Circuit
VIN
VDD RL VOUT
Gate Charge Test Circuit
VGS
VDD RL
RG
1mA
RG
STAD-JUL.19.2006
PAGE . 2
PJD06N03
Typical Characteristics Curves (TA=25 C,unless otherwise noted)
O
ID - Drain-to-Source Current (A)
100
80
VGS=10V, 6.0V, 5.0V, 4.5V, 4.0V
80
ID - Drain Source Current (A)
V DS=10V
3.5V
60
60
40
T J=125 C
O
40
3.0V
20
20
T J=25 C
O
2.5V
0
T J=-55 C
O
0 0 1 2 3 4 5 1.5 2 2.5 3 3.5 4 4.5 V GS - Gate-to-Source Voltage (V)
V DS - Drain-to-Source Voltage (V)
Fig. 1-TYPICAL FORWARD CHARACTERISTIC FIG.1- Output Characteristic
FIG.2- Transfer Characteristic
15
30
R DS(ON) - On-Resistance (m W )
R DS(ON) - On-Resistance (m W )
I D=30A
12 9 6 3 0 0 10 20 30 40 50 60 70 80 90 ID - Drain Current (A)
25 20 15 10 5 0 2 4 6 8 10 V GS - Gate-to-Source Voltage (V)
V GS=4.5V
V GS=10V
T J=125 OC T J=25 OC
FIG.3- On Resistance vs Drain Current
FIG.4- On Resistance vs Gate to Source Voltage
RDS(ON) - On-Resistance (Normalized)
1.4 1.3
V GS=10V I D=30A
1.2 1.1 1 0.9
0.8 0.7
-50
-25
0
25
50
75
100
o
125
150
TJ - Junction Tem perature ( C)
FIG.5- On Resistance vs Junction Temperature
STAD-JUL.19.2006
PAGE . 3
PJD06N03
VGS - Gate-to-Source Voltage (V)
10 8 6 4 2 0 0 5 10 15 20 25 30 35 40 Qg - Gate Charge (nC)
Vgs
Qg
V DS=15V I D=15A
Vgs(th)
Qsw
Qg(th)
Qgs Qgd
Qg
Fig.6 - Gate Charge Waveform
29
BVDSS - Breakdown Voltage (V)
Fig.7 - Gate Charge
Vth - G-S Threshold Voltage (NORMALIZED)
1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 -50
I D=250uA
I D=250uA
28
27
26
-25
0
25
50
75
100
125
150
25 -50
-25
0
25
50
75
100
125
150
TJ - Junction Tem perature (oC)
TJ - Junction Temperature (oC)
Fig.8 - Threshold Voltage vs Temperature
Fig.9 - Breakdown Voltage vs Junction Temperature
100
IS - Source Current (A)
V GS=0V
10
1
T J=125 OC
T J=25 OC
T J=-55 OC
0.1
0.2
0.4
0.6
0.8
1
1.2
1.4
VSD - Source-to-Drain Voltage (V)
Fig.10 - Source-Drain Diode Forward Voltage
LEGALSTATEMENT
Copyright PanJit International, Inc 2006
The information presented in this document is believed to be accurate and reliable. The specifications and information herein are subject to change without notice. Pan Jit makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose. Pan Jit products are not authorized for use in life support devices or systems. Pan Jit does not convey any license under its patent rights or rights of others.
STAD-JUL.19.2006 PAGE . 4


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